PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD6L SOT-23 All Date CodesMatte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0170
MCP4013T-103E/CH |
RFQ for MCP4013T-103E/CH |
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| Technical/Catalog Information | MCP4013T-103E/CH |
| Vendor | Microchip Technology (VA) |
| Category | Integrated Circuits (ICs) |
| Number of Circuits | 1 - Single |
| Resistance In Ohms | 10K |
| Interface | Up/Down |
| Taps | 64 |
| Package / Case | SOT-23-6 |
| Packaging | Cut Tape (CT) |
| Voltage - Supply | 1.8 V ~ 5.5 V |
| Memory Type | Volatile |
| Temperature Coefficient | 150 ppm/°C Typical |
| Operating Temperature | -40°C ~ 125°C |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP4013T 103E CH MCP4013T103ECH MCP4013T 103E CHCT ND MCP4013T103ECHCTND MCP4013T-103E/CHCT |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP4013T-103E/CH | - | - | - |